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All exposed metal will be (specify your surface finish requirement here). A Type 2 flex structure with access holes on both sides and plated through holes. Minimum copper wall thickness of plated through holes to be (your requirement here; .001 average is recommended) with a minimum annular ring of (your requirement here; 002 is recommended). IPC2581B - as with ODB++, supporting multiple layer stack definitions and polygons of layer stack regions. It is very simple to do and does not require the use of movie key frames during the folding sequence. Rigid Printed Circuit Board Design, Layer Stackup In Rigid-Flex and Flexible Printed Circuit Boards. NOTE: This Guide was written for Altium Designer 18. As you place additional features on a flexible design of a printed circuit board, youll need to model your boards mechanical behavior. Delivering a working electromechanical design requires close and constant collaboration between the mechanical and electrical engineering teams. Many electronic devices dont live on a single printed circuit board. To enable the features needed to design a rigid-flex board, open the Tools Features sub-menu or click the Features button () to select either the Rigid-Flex command, or the Rigid-Flex (Advanced) command. Once the overall outline has been defined, it is split into the different rigid and flex regions. Refer to this article for more information. To be able to select the Board Region or a Bending Line you must switch to a different layer, for example the Multi-Layer. While dragging, the coverlay polygon can be rotated or mirrored: Pad/via openings - the output for pad/via openings is generated in the same way as regular top/bottom solder mask output: an object of the correct size/shape is flashed, in accordance with the applicable solder mask expansion design rule, or the object settings if the local override is enabled. A common feature on rigid-flex boards is the selective use of coverlay material. In a traditional rigid PCB, these insulating layers are typically fabricated using FR4 and pre-preg, although there is a range of materials available, each with properties that suit different applications. Many electronic devices dont live on a single PCB. How are placement and routing within flex regions different from that of traditional rigid PCBs. This is achieved by having an overall master layer stack that defines the total set of layers available to the board designer in this design. This guide provides an overview of all the steps implemented in the flex PCB manufacturing process. This guidebook is an attempt to clearly explain the materials, processes and design issues in a way that will enlighten PCB designers of any level.This paper highlights several key considerations for rigid-flex design. The covercoat material shall be per IPC 4203/1. These processes are very similar to rigid PCB fabrication processes, but involving different material sets as illustrated in an earlier guide. Service loop - make the flex region slightly longer to help with assembly/disassemblyand to allow for product dimensional variations (the extra length is referred to as the service loop). Contact our corporate or local offices directly. Based on guidelines from Altium, and various other sources, it is important to have "staggered lengths", to prevent the PCB from buckling when it is bent. This distinction is important as it affects both the material selection and the construction methodology. If two Board Regions are overlapped (and those regions have common layers), then the stack with more layers is applied in the overlapping area. There are many engineering and scientific disciplines that must be harnessed and managed to bring your vision to life. If your design has more complex rigid-flex requirements, such as overlapping flex regions, then you need the Advanced Rigid-Flex mode (also known as rigid-flex 2.0). PCB Design Guide for Engineers Part 1: The Team This PCB Design Guide for Engineers: Part 1, Altium Designer Evaluation Guide for Autodesk EAGLE Users_2017, Altium Evaluation Guide For Autodesk Eagle Users, PCB Design Guide for Engineers: Part 2 Planning, PCB Design Guide for Engineers Part 2 - Planning The PCB Design Guide for Engineers is a series that serves as a guide for the novice/student, or electronics engineering professional. These include: squeeze-out, where the adhesive is squeezed out into openings cut into the cover layers to access copper layers; Z-axis expansion defects due to the higher CTE (coefficient of thermal expansion) of acrylic adhesive; and moisture out gassing due to the higher rate of moisture absorbance, which can result in resin recession, blow outs and delamination at plated through hole sites. Altium Designers Layer Stack Manager and Board Planning Mode are powerful features to get started with your layout. For a dynamic application, aim for a bend ratio of 20-40:1. The rigid material shall be GFN per IPC-4101/24 (if using epoxy material). A bend in a flexible section of a rigid-flex board is defined by placing a Bending Line. Two conductive layers with an insulating layer between; outer layers can have covers or exposed pads. The Flex PCB shall be constructed to meet a minimum flammability rating of V-0 (if required). For single-layer circuits, the minimum ratio should also be at least 5:1. Define the overall board shape, and then slice it into regions. Do not add this note if this thickness is not critical. Size, weight, the ability to bend around corners and to flex during use to name just a few. Below is a summary of key design areas that must be considered when designing a rigid-flex PCB: Typical suggested documentation requirementsinclude: Flex and Rigid-Flex Circuits Technical Engineering Guide - Epec Engineering Technologies, Flexible Circuit Technology - JoeFjelstad, Flex Circuits Design Guide - Minco Products Inc. As part of the built-in Design Rule Check engine, To ensure that all sections of the finished board fit in their folded location within the enclosure, it is strongly recommended that a mechanical mock up (also known as a paper doll cut out) is created. Todays small lightweight consumer electronics products are best implemented with rigid-flex technology, however, there can be many challenges in achieving successful rigid-flex PCB designs. A printed circuit board is designed as a series of layers stacked on top of one another. For dynamic double-sided flex circuits, try to avoid laying traces over each other in the same direction. In some boards, the flexible circuit ribbon also has multiple layers, and a plane layer can be routed across a flex ribbon. In the image below, you can see that the board includes a battery and a battery clip. Click once on a coverlay polygon object to select it, which puts it into edit mode. Designing any PCB is a three-dimensional design process, but for a flex or rigid-flex design the three-dimensional requirements are much more important. Note the additional tab for each coverlay layer added in the substack, click on a layer tab to make that layer the current layer, and examine or edit the coverlay. The copper foil is typically coated with a photo-sensitive layer, which is then exposed and etched to give the desired pattern of conductors and termination pads. |  Created: March 1, 2018 Each Bend can be named so it can be easily identified. They have an elongated grain andit is important to orient this correctly in a dynamic flex circuit to achieve the maximum flexing lifespan. This can improve the adaptability of your PCBs and allows PCB designers to customize their boards to odd packaging. Double-sided flexible printed wiring containing two conductive layers with plated through holes, with or without stiffeners. Use the Fold State slider (or theView Fold/Unfold command) to apply all Bending Lines in the order defined by their sequence value (Fold Index). Then use the tools available to convert a selected outline to a board cutout, or a board region. Plated through-holes extend through both rigid and flexible layers (apart from blind and buried vias). At first glance, a typical flex, or rigid-flex board, looks straightforward. The PCB editor includes a powerful 3D rendering engine, which allows the presentation of a highly realistic three-dimensional representation of the loaded circuit board. The automatic coverlay is formed as a polygonal object, it can be selected and reshaped (or deleted) as required. The outer edge of the coverlay, as well as user-defined cutouts, are rendered as outlines - these outlines can be used by the fab house to generate a cutting path. Coverlayer - avoid stress risers (exposing the incoming track);reduce opening in coverlayerto250um. Contact our corporate or local offices directly. Main Article: Defining Board Regions and Bending Lines. Double-click on a region to open the Board Region dialog and assign the required layer stack. This allows printed circuit designers to customize their board to odd enclosures, design motion into new devices, and provides unique form factors that are not possible with rigid boards. It would make life easier if all printed circuit boards were the same size and shape, but thats not the way it works. Silkscreen both sides of the board (if required) using white or yellow (most common) non-conductive epoxy ink. There are a number of layer stackup configurations that can be fabricated as rigid-flex, each with its own electrical, physical, and cost advantages. By its very nature, it's difficult to achieve the accuracy and realism required with this approach. A board with a flex region inside a cutout can only be created in Advanced Rigid-Flex mode. Panelization - orient the flex regions to suit the grain of material (bend along the grain). Define the Substack needed for each Region of the board, and configure how those Substacks align with each other in the Z plane. The Flex PCB shall be constructed to meet a minimum flammability rating of V-0 (if required). For the latest, read: Designing a Rigid-Flex PCB for version 23 Applies to Altium Designer versions: 20.0, 20.1 and 20.2 Contents What is Rigid-Flex? The copper layers are separated by insulation layers. The powerful CAD tools, layout options, and customizable routing and via tools make it easy to build any rigid-flex PCB. The Rigid-Flex PCB Manufacturing and Fabrication Process Because the rigid-flex board may attach to multiple surfaces within the product enclosure, with the attaching and folding process often happening during product assembly. User-defined coverlay shapes can also be placed if required, using the, If a Board Region that has coverlay defined is moved, the coverlay polygon will not move with it. The Advanced rigid-flex mode does not use Split Lines, instead the edge of the Board Region defines where one Substack ends and the adjacent Substack begins. The Flex PCB shall be fabricated to IPC-6013, class (your requirement here) standards. Define the shape of each rigid and flex Region in the X-Y plane, and assign the correct Substack to each Region. In the above image, the backside of the flex board may be permanently deformed and creased so that the final board keeps its shape. These divide the board into three separate regions. It ispopular today as it not only saves space and weight - making it ideal for portable devices such as mobile phones and tablets - it can also: reduce packaging complexity by substantially reducing the need for interconnect wiring; improve product reliability due to reduced interconnection hardware and improved assembly yields; and reduce costwhen considered as part of the overall product manufacture and assembly costs. The thickness of acrylic adhesive through the rigid portion of the panel shall not exceed 10% of the overall construction. This is simply a display feature. Hold the. To move a Bending Line, click and drag on each end handle. Rigid-flex PCB design might seem like a complicated affair, but it doesnt have to be when you use the right design tools. Each record in a database table is a component, referencing the required models and parametric component data, This page looks at components in a Workspace Library. Altium Designer also supports rigid-flex when designing the physical assembly board of a multi-board design. Three or more flexible conductive layers with flexible insulating layers between each one; outer layers can have covers or exposed pads. The image below shows an example of a board with static ribbons. ODB++ - Specific layer stack material regions are output (polygons and polygon cutouts) in ODB++ v7.0 and later, which properly supports multiple layer stacks and rigid-flex definitions. These are summarized below. A Type 4 rigid-flex structure;the rigid sections are formed by adding rigid layers to the outside of the flex structure. Split Lines are defined in Board Planning Mode (View Board Planning Mode or shortcut key 1).The image below shows a board shape that has been divided into three regionsby the placement of the two horizontal blue Split Lines. Learn more about static and dynamic mechanical requirements for flex PCB design. If coverlay layers are added to the substack after that substack has already been assigned to a Board Region, then coverlays must be added to that region. The Types are defined in the following standards: IPC 6013B - Qualification and Performance Specification for Flexible Printed Boards, MIL-P-50884E - Military Specification: Printed Wiring Board, Flexible or Rigid-Flex, General Specification for (available here). Altium Designer makes it easy to customize your layer stack-up. Flexible printed circuits are designed using photolithographic technology. ALTIUM DESIGNER A PCB design tool guaranteed to get your circuit board right or keep it circular. This is measured over finished plated surfaces. You can directly design the enclosure around your finished circuit board layout by importing your design into popular mechanical tools. Typically used for static flex applications. By knowing the fabrication process, you'll have assurance you can hit yield and performance targets. We've included over 100 pages with detailed examples, a huge glossary, and much more. Download the PcbDoc file used in the video. Routing between multiple boards on a rigid-flex PCB spreads your components over a large area, and your enclosure needs to be designed alongside the mechanical shape of your board. A bending Line is a linear object, whose properties are edited in the Bend mode of the Properties panel. This method of editing allows you to select a placed coverlay polygon object directly in the design space andgraphically change its size, shape or location. Note that the bends are applied in the order defined by their sequence number. As the project engineer, your first task is identifying your team. Learn more about designing a layer stack-up for a flexible or rigid-flex PCB. Prior to working in the PCB industry, he taught at Portland State Universityand conductedresearch on random laser theory, materials,and stability. Why? An integrated PCB editor along with real-time connection to multiple domains. Your design software shouldnt be limited to working with FR4, you need design software that lets you customize everything from board footprint to your layer stack. When the Coverlay layer is the active layer, clicking on the Board Region will select the Coverlay, not the region. Flex circuits are created from a stackup of flexible substrate material and copper that are laminated together with adhesive, heat and pressure. Highlight the area, then use. To apply all of the Bending Lines, slide the Fold State slider in the PCB panel when set to Layer Stack Regions modeas highlighted in the image below.  | , Entry Level, Professional PCB Design Tool, Free PCB design for makers, open source and non-profits, See why and how to switch to Altium from other PCB design tools, Extensive, Easy-to-Use Search Engine for Electronic Parts, EBook: HDI PCB Design and Manufacturing Guide. You can design your electronic device with the odd form factor and with interesting new applications in mind. Entry Level, Professional PCB Design Tool, Free PCB design for makers, open source and non-profits, See why and how to switch to Altium from other PCB design tools, Extensive, Easy-to-Use Search Engine for Electronic Parts, Flex and Rigid-Flex PCB Design Guidelines and Assembly in Altium Designer, Flex Circuit Design Guide: Getting Started with Flexible Circuits. Easily design schematics of any complexity. Bending Lines can share the same sequence number;it simply means that those bends will be folded at the same time when the Fold State slider is used. For other boards like rigid-flex and flex circuit boards, including some that may be utilized in aerospace systems, a specific degree of flexibility or rigidity is required. It only becomes an issue if the designer performs their own circuit panelization (referred to as nesting in flex circuit design). Service loop - make the flex region slightly longer to help with assembly/disassemblyand to allow for product dimensional variations (the extra length is referred to as the service loop). Through holes - try to avoid through holes in the bend area, particularly in a dynamic application. Youll need to understand the mechanical properties of your materials to design the right bend radius, and many of the foundational concepts of rigid boards still apply. Refer to the PCB 3D Video page for a detailed description of how to make a 3D movie. Flex and Rigid-flex PCB Design in Altium Designer. Working with flex or rigid-flex PCBs requires customizing your layer stack-up. This tutorial will start with a sketch of a circuit and will take you through the process of representing the circuit as a schematic, implementing the circuit as a printed circuit board, and generating the outputs required for board fabrication. A section of custom coverlay has been placed and a cutout is about to be defined in it. In the standard rigid-flex mode, the boundary between two Board Regions is defined by placing a Split Line. The integrated ECAD and MCAD tools let you do more than just verify clearances. Meet demands of a globalized market that requires unique versions of your PCBs. This article will discuss the challenges and solutions in designing PCBs with rigid-flex features. The rigid material shall be GIN per IPC-4101/40 (if using polyimide material). Main article: Defining Board Regions and Bending Lines. To support the need to define a different set of layers in different areas of the board design, the PCB editor supports the concept of multiple layer stacks. Altium design model integrates layer stackup management, layout, advanced routing, and design rule checking features in a single, unified design environment. A more statistically optimal hatch pattern would be hexagonal. This tutorial is based on an astable, PCB Design Guide for Engineers: Part 1 The Team, INTRODUCTION What people are involved in the PCB design & engineering process? Flexible circuit technology was initially developed for the space program to save space and weight. This insulation layer is cut and laminated onto specific areas of the board, and because of this selective use, coverlay is also referred to as bikini coverlay. This page takes a detailed look at support for rigid-flex design in Altium Designer - the name given to a design that is a combination of both flexible circuit(s) and rigid circuit(s) - _AD | Altium Designer 17.1 | Mobile menu Altium Designer Design tools with integrated 3D design features, as well as standard routing and layout tools that operate in 3D, will easily adapt to rigid-flex and flex circuit boards. In Board Planning mode there will now be additional tabs for each coverlay layer added in the stack. His work has been published in over a dozen peer-reviewed journals and conference proceedings, and he has written 2000+ technical articles on PCB design for a number of companies. Custom Coverlay is a mask layer and behaves as an additional Solder Mask layer. There are a number of standard stackups available for flex and rigid-flex circuits, referred to as Types. Flex & Rigid-Flex Solutions Flexible Circuit Capabilities Design & Development Altium Designer on Altium 365 delivers an unprecedented amount of integration to the electronics industry until now relegated to the world of software development, allowing designers to work from home and reach unprecedented levels of efficiency. He previously served as a voting member on the INCITS Quantum Computing Technical Advisory Committee working on technical standards for quantum electronics, and he currently serves on the IEEE P3186 Working Group focused onPort Interface Representing Photonic Signals Using SPICE-class Circuit Simulators.

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